Support & Resin Removal submersion solution

The PostProcess™ DEMI 400™ Series offers automated Support & Resin Removal submersion solutions for PolyJet and FDM supports, as well as excess resin from SLA, CLIP, and DLP technologies. Each version in the DEMI 400 Series incorporates our patented Submersed Vortex Cavitation (SVC) technology, which utilizes a rotating motion in fluid to ensure even exposure to induced mechanical agitation.

With our proprietary software and exclusive detergents, the DEMI 400 provides precise, hands-free post-printing for additive manufacturing workflows, adjusting time and temperature based on the material and geometry of the 3D printed part.