DEMI 200 – Support & Resin Removal

Support & Resin Removal solution

The PostProcess™ DEMI 200™ Support & Resin Removal solution offers a compact bench-top design with a versatile envelope for large or small geometries. It excels at removing PolyJet and FDM supports and excess SLA, DLP, and CLIP resin.

With patented Submersed Vortex Cavitation (SVC) technology, the DEMI 200 efficiently disposes of support material and ensures even exposure through rotating motion in fluid. Paired with our proprietary software and exclusive detergents, it provides precise, hands-free post-printing for 3D printed parts, with customizable time and temperature settings based on the material and geometry.

Software Features

  • Variable temperature (70-156°F / 21-69°C)
  • Programmable cycle times
  • Proprietary Agitation Algorithms

Hardware Features

  • Digital interface
  • Piezo-electric Ultrasonics
  • Stainless steel envelope
  • Removable envelope lid
  • Magnetically driven pump
  • Drain and hose

Meet the demands of volume production!

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